干法蝕刻系統
Dry Decapper ES 312是以反應性離子氣體為主導，對集成電路等電子元器件上的樹脂進行解封的優良系統。
We can promise the Efficient Dry Decapsulation for 3 samples at once by Automatic Matching and N2 gas regular blowing for residue.
Automatic Operation up to the end of Decap
Max 3 samples at once
High Repeatability Etching
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